Effect of MeV O2+ implantation on the reactive ion etch rate of LiTaO3
Identifieur interne : 00C449 ( Main/Exploration ); précédent : 00C448; suivant : 00C450Effect of MeV O2+ implantation on the reactive ion etch rate of LiTaO3
Auteurs : Patrick W. Leech [Australie] ; Mark C. Ridgway [Australie, France]Source :
- Nuclear Inst. and Methods in Physics Research, B [ 0168-583X ] ; 1999.
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Abstract
Abstract: The etch rate of LiTaO3 in CF4/CHF3 plasmas was increased by ∼50% by prior implantation with MeV O2+ ions. The etch rate of LiTaO3 was shown to increase with ion dose, indicating an effect of the implant-induced nuclear damage on the etch process. In general terms, the reactive ion etching of LiTaO3 in CF4/CHF3 plasmas has been identified as a process of ion-enhanced chemical etching.
Url:
DOI: 10.1016/S0168-583X(99)00578-9
Affiliations:
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Le document en format XML
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<front><div type="abstract" xml:lang="en">Abstract: The etch rate of LiTaO3 in CF4/CHF3 plasmas was increased by ∼50% by prior implantation with MeV O2+ ions. The etch rate of LiTaO3 was shown to increase with ion dose, indicating an effect of the implant-induced nuclear damage on the etch process. In general terms, the reactive ion etching of LiTaO3 in CF4/CHF3 plasmas has been identified as a process of ion-enhanced chemical etching.</div>
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